Main Features:
1.It can produce with different length.The products output in line.
2.Heat embossing device, according to the customer , It can add a spray hot melt adhesive bonding, add absorbent polymer devices.
3.The use of advanced PLC as the master, touch screen operation,together with step-by-step fixed-length, operating more simple and convenient.
4.Heat embossing method of heating pressure bonding, spraying hot melt adhesive bonding equipment is extra added device of glue-spraying,Hot melt adhesive bonding.
Main Technical parameter:
Model | HC-PDM-FS | HC-PDM-FF |
Working Speed | 180m/min | 130-150m/min |
Electric Power Supply | 3 Phase 380V/50Hz | |
Total Power | 140kw | |
Pass Rate | ≥97% | |
Total Weight | 10Ton | |
Outline Dimension (L*W*H) | 25*3.8*2m |
Details:
Finished product: